Experimental investigation of hotspot removal using superlattice cooler

Thermal management of high performance microprocessors is becoming increasingly challenging due to the presence of hotspots. Temperature at the hotspot can be substantially greater than rest of the microprocessor, potentially compromising performance and reliability. In this paper, we have presented a hybrid cooling scheme which combines microfluidic and solidstate cooling techniques. Localized hotspot with heat flux close to 250 W/cm
²
has been successfully removed using this hybrid scheme. The effect of ambient temperature, hotspot size, and superlattice cooler electrode location is also studied.