Reliability of microelectronics packaging in the era of EnergyWise and Borderless networks

In an ever-increasingly connected world, the boundaries or obstacles to accessing information are being torn down by business necessity, personal preferences and technical innovations. The Borderless Network is creating the ability for customers to work anywhere, with any device using services and applications like video, collaboration, with a secure, reliable and seamless communication experience. The customer will also experience reduced energy consumption from network attached devices thanks to innovations made in the microelectronic devices, systems that enable the next generation of smart and EnergyWise networks. In this paper, challenges and opportunities in reliability of microelectronics packaging for the next generation of EnergyWise, Borderless networks will be reviewed. The impact of materials, manufacturing processes and field environmental conditions on the packaging reliability will be discussed with one case study.