Nickel filled adhesives

To make a conductive adhesive that can replace solder, we studied the following compositions: nickel as the conductive filler, an epoxy resin for the base resin and various phenolic resins as the curing agent. We found nickel-containing pastes that could cure at a relatively low temperature in short period having good adhesion strength. Moreover, we used these pastes for MLCC bonding in place of solder and found that, despite the fact that their volume resistivity was considerably higher than that of solder, their electrical properties were good.