Analysis methods of circuit elements buried in ceramic multilayer substrate

The measurement and modeling methods of multilayer devices buried in Ceramic Multilayer Functional Substrates (CMFS) are developed to improve the accuracy of simulation. For measurements, TRL, a 2-port calibration method and a microstrip test fixture were used. The equivalent circuit models consist of basic lumped circuit elements, and the values of elements are calculated using the Finite Element Method (FEM). We obtain the equivalent circuit model of the bypass (shunt) capacitor in good agreement with measured values.