A technology-, cost- and time-based comparison of MCM substrate alternatives based on an international survey

Multichip module (MCM) technology is widely known to close the gap between conventional printed circuit board (PCB) assembly and wafer scale integration (WSI). Numerous papers have discussed the improvements in terms of size and weight reduction, higher clock rates, lower power consumption, etc., that can be achieved by the use of MCM technology. Since MCMs come in a vast variety of different substrates, interconnection technologies and packaging solutions it is very difficult to select the best MCM configuration for a given application. In every single case trade-off decisions with regard to technical properties cost, and time to market must be made. This paper discusses the results of an international MCM survey carried out at the Swiss Federal Institute of Technology in Zurich (ETH Zurich). Besides the technical properties of various MCM substrates, the survey also covers cost and time to market related information. The paper provides a comparison of the various MCM substrates currently available. The relationship between certain technical parameters considering the different substrate technologies is outlined. In addition, cost data derived by a state-of-the-art product sample provided by the participating companies are included in these examinations. To take into account the time to market aspects a substrate cycle time analysis as well as a packaging cycle time analysis has been performed. The effectiveness of different measures to shorten MCM development as seen by the industry is compiled.