X-ray nanoCT of interconnections in IC packages: Visualizing of internal 3D-structures with submicrometer resolution

Miniaturised and concealed electrical interconnections in IC packages including copper and gold wire bonds, flip chips and microvias were inspected by nanofocus X-ray tube technology and nanofocus computed tomography. The 2D and 3D X-ray imaging technology is concisely described and various analysis results and defect examples at sub-micrometer resolution are presented.