Board level reliability assessments of thru-mold via package on package (TMV™ PoP)

In recent years, package-on-package (PoP) has been adopted as major application package platform in 3D integration of logic and memory devices. However, as electronic technology developed, higher technology requirements are requested in packaging. Amkor Technology, Inc introduced the next generation PoP solution to meet the next generation technology requirements in 2008 by the using of TMVtrade technology which incorporates a laser ablation process that is conducive to current matrix-molded semiconductor assembly techniques. The next generation PoP platform named as TMVtrade PoP has been qualified in all package level qualification tests. Also in board level reliability tests, BLR TC & drop performances are similar or better than those of the conventional PoP.