Effect of PIII on the adhesion behavior of epoxy molding compound-nickel interface

The Cu leadframes pre-plated with nickel-coating were implanted with oxygen ion or nitrogen ion by Plasma Immersion Ion Implantation (PIII) technique. The contact angle measurement showed that ion-implantation lead to an obvious change of wettability. The chemical situation of the leadframe surfaces was analyzed by X-ray Photoelectron Spectroscopy (XPS), while the morphology of the leadframes was observed by scanning electron microscope (SEM). A pull-test was employed to examine the influences of ion-implantation on adhesion between the leadframe surface and molding compound.