Theoretical and experimental quantitative characterization of the near-fields of printed circuit board interconnection structures

In this paper, the near-field radiation from printed circuit boards is studied quantitatively by means of a new in-house developed three-dimensional measurement set-up. Special attention is given to the development, characterization and calibration of the near-field probes. The performance of the whole measurement set-up is evaluated by comparing the calibrated measurements above a single microstrip line with simulated results. A very good agreement is observed. Moreover, by means of a two-dimensional near-field scan over a more complex printed circuit trace, the capabilities of the developed measurement set-up in order to locate and quantify the sources of radiated emission are highlighted.