A framework of equipment maintenance and service with application to wire bonder

A framework is proposed for the maintenance and service of semiconductor equipment. The proposed framework consists of a system of equipment failure analysis, methods, process, and activities, and a procedure in maintenance and service. The maintenance procedure is constructed by integrating value engineering, quality function deployment, mechatronics engineering, technique from R&D and supplier, and Taguchi method with axiomatic design mapping. The ultimate value of maintenance management of a wire bonder machine, K&S (Kulicke and Soffa) Maxμm Plus, in the first bond failure is illustrated.