Advances in MCM packaging for microprocessors

Although MCMs have been used for processor modules for high end computers since the 1970s, it was not until the 1990s that cost effective MCM technologies have been available for complete processor modules in workstations and other moderate cost computers. In the past 5 years, many technology improvements have enhanced the performance and decreased the effective cost of MCMs. Flip-chip, laminated memory, interleaved wirebonds and thin film passive networks have improved performance and packing density. Simplified packages and hybrid interconnect schemes of cofired and deposited interconnects (or laminated and deposited interconnects), as well as several of the aforementioned technologies, have further reduced cost. Case studies show the benefits of these improvements.