Test strategies for multi-chip modules based on economics considerations

This paper describes an economics based methodology for the investigation of test strategies for multi-chip modules. Multi chip module technologies offer a way of overcoming the interconnection bottleneck which can be a problem with conventional interconnect technologies as the complexity of integrated circuits increases through the use of rapidly diminishing feature sizes. The use of multi-chip modules (MCMs) has many advantages in terms of size, weight and power (e.g. in satellite applications), increased functional density and possibly improved reliability over PCB based solutions.