Noise characterization and sensitivity analysis of IC packages

Techniques of determining the performance of IC packages and sensitivity analysis of noise to package physical parameters in electronic systems are presented. Results are shown for noise characterization of various drivers on the packages and sensitivity of noise parameters to package design parameters. Using the techniques of noise characterization, package and I/O driver performance limits in the system can be evaluated. Using the techniques of sensitivity analysis, performance improvement of any changes in the package design can be predicted and the package can be optimized during the design phase to satisfy electrical requirements of the system.