SPI proceedings: Investigation of the interactions between vias and the power-bus

Physics-based models are widely used for the description of vias in multilayer PCBs. In this paper, such a lumped model for a via in a 4-layer PCB and the extraction of its elements are described. Furthermore, the undesired interactions between the via and the power-bus in a 4-layer PCB are investigated using the calculation of a combined lumped model and measurements of S-parameters.