An experimental technique for full package inductance matrix characterization

A new experimental technique based on a network analyzer was developed for characterizing the full inductance matrices (both self and mutual inductance) of package/interconnect structures. This frequency-domain based measurement technique, including its formulation and procedure, is discussed in this paper. A total of four packages, an 120QFP, a 400TAB, a 313PBGA, and an Alloy 42 132CQFP were selected for the self/mutual L characterization. The measurement results are compared to those obtained by using a time domain reflectometer (TDR)-based technique as well as with the modeling data calculated by 3-D EM tools.