Nano Packaging - A challenge for Non-destructive Testing

The challenge of nano packaging requires new non-destructive evaluation (NDE) techniques to detect and characterize very small defects like transportation phenomenon, Kirkendall voids or micro cracks. Imaging technologies with resolutions in the sub-micron range are the desire. Possible evaluation methods are for example x-ray microscopy, x-ray tomography, ultrasonic microscopy and thermal microscopy. However, techniques with the necessary resolution can not be found on the market. The Center for Non-Destructieve Nano Evaluation of Electronic Packaging (nanoeva®) is taken up to develop this equipment in cooperation with the electronics industry and to transfer the knowledge to colleagues in industries and research institutions. The new center is a common organization of Fraunhofer IZFP-D and the Electronics Packaging Lab with its Centre of Microtechnical Manufacturing (ZμP) of the Technische Universität Dresden. This paper will focus on the new possibilities of nano x-ray CT and shows first results.