Development of LCP surface mount package with a bandpass feedthrough at K-band

We present the development of thin-film Liquid Crystal Polymer (LCP) surface mount packages with a novel bandpass feedthrough at K-band (18 – 27 GHz). The packages are constructed using multi-layer LCP films and can be surface mounted on a printed circuit board. Our experimental results demonstrate that the bandpass package feedthrough transition including bond wires achieve a return loss of 13 dB or higher and an insertion loss of less than 0.5 dB across K-band. The package transition offers 0.2 dB insertion loss and ≫15 dB return loss across X-band, and operates well across 8 – 27 GHz.