Thermal managerment of high power memory module for server platforms

This paper demonstrates an approach for thermal solution development of high power memory module for computer system platforms. A lumped thermal resistance equation is adopted to consider the coupling between register/buffer and DRAMs. Comprehensive thermal analysis is done to characterize the thermal resistances under various memory thermal conditions in different system configurations. Memory thermal gap is identified and addressed with efficient and low cost thermal solutions such as full DIMM heat spreader (FDHS). Structural consideration is further discussed to address FDHS air gap risk related to height differences between DRAM and register/buffer packages. The thermal solution development approach is applicable to memory modules such as registered DIMM (RDIMM) or fully buffered DIMM (FBD).