Application of Atmospheric Plasma Abatement System for Exhausted Gas from MEMS Etching Process

For the reduction of global warming potential (GWP) gases such as PFCs from semiconductor manufacturing process, we have developed an atmospheric plasma abatement system that has high decomposition efficiency. We have applied the plasma abatement system for decomposition of PFCs in exhausted gas from MEMS (micro electro mechanical system) etching process and have carried out the beta test. We have demonstrated that the plasma abatement system was available for MEMS etching process with high efficiency and durability for reduction of PFCs emission during stable operation.