A miniaturized electron beam deflector and lens module with vertical interconnection using anodic bonding and Zn reflow

An 8x8 array of electron beam deflector and lens module was developed using a vertical interconnection based on anodic bonding and Zn reflow. It was fabricated using 4 inch wafers and the size of one module is 8x8mm . A uniform electroplating condition of Zn was developed and void-free anodic bonding of Si-glass-Si which included Zn metal was confirmed by IR image. Zn was successfully reflown and spread on the Ni above the melting temperature. This method can be applied to the various packaging or interconnection of devices composed of stacked wafers because the signal pad is easily extended to the top side using the vertical interconnection.