High-Density 8Mb 1T-1C Ferroelectric Random Access Memory Embedded Within a Low-Power 130nm Logic Process

Ferroelectric memories are the most promising alternative to traditional embedded non-volatile memories, such as flash and EEPROMs, because of their fast read/write cycle time, non-volatile data retention, low voltage/low power operation and low number of additional masks for fabrication (±2). An embedded ferroelectric memory (FRAM) has been developed using a 1.5V, 130nm 5 metal layer Cu/FSG logic process. The only modification to the logic process was the addition of a ferroelectric process module consisting of two additional masks (FECAP, VIA0) immediately before MET1. The ferroelectric was 70nm Pb(Zr,Ti)O
3
(PZT) deposited by metalorganic chemical vapor deposition (MOCVD). The electrical properties of a 8Mb 1T-1C embedded FRAM were characterized. This eFRAM process has been used to simultaneously fabricate a digital signal processor (DSP) using the eFRAM process flow and the operating frequency is nearly the same relative to the CMOS baseline. This eFRAM process flow creates a technology platform that enables ultra-low-power devices.