Synthesis and dielectric properties of poly(epoxyimide)-nano silica hybrid film by CS sol process

The new PEI-ano Silica hybrid films prepared from CS sol process have a stable chemical bonding and uniform distribution of nano silica. The decrease property of dielectric constant with CS content, and tangent loss consistent of given frequency and temperature was explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. PEI-CS sol hybrid film with such stable chemical and dielectric properties is expected to be used as high functional coating application in ET, IT and electric power products.