The influence of thermal gradients on the characterization of Schottky-barrier diodes

A simple and fast method of measuring the electrical performance of a packaged array of Schottky diodes as a function of temperature is described. The technique utilizes the device's ceramic package as the isolating thermal resistance. The effective thermal conductivity of the experimental arrangement is investigated, allowing the cooling times and temperature distribution of the system to be determined. In particular, attention is given to the variation between device operating temperatures and those obtained from a diode temperature sensor mounted in close proximity to the die.<
>