Influence of Technological Parameters on the Behavior during Aging at High Temperature of Various Packages, in the Automotive Environment

This study is related to the packaging in the automotive mechanism is not accelerated by corrosion. environment and is a part of the qualification at 150°C of various packages of AVR microcontrollers. Different failure mechanisms can be generated by aging at high temperature D t Die bottom Lead-frame and one critical failure site is on the ball bond. The major -RI failure mechanism is here related to the Kirkendall voids, R4 consequence of the intermetallic thickness growth.