Wirebonding Characterization and Optimization on Thick Filmsu-8 MEMS Structures and Actuators

We present the first successful wirebonding on thick SU-8 actuators reported in the literature with a thorough investigation to determine the best processing conditions to produce reliable electrical connections to SU-8 MEMS structures. We measured the yield and mechanical strength of gold ball bonds for a variety of processing conditions on SU-8 structures up to 100 μm thick covered with a thin gold layer. Optimized processing conditions result in ball bonds with high adhesion strength and very low contact resistance. Multiple SU-8 based actuators have been electrically connected and operated demonstrating high reliability and yield.