Simulation-Aided Thermal Design of Intermittent Power Transistor Packages

This study utilizes CFD simulation to assist design of package structures for intermittent-working last stage power transistors. Considering systems' intermittent features, the thermal analysis and simulation indicate that simplified package structures are feasible, which result in compact packages with conventional materials and processes, thus lower cost. The simulation includes cases for conduction-only and for conduction-convection combined effects. The results lead to the conclusion that convection can be neglected if the power-on duty cycle is extremely low.