Passi4: The next Technology for Passive Integration on Silicon

A new technology for passive integration on silicon is presented. Accurate low density capacitors, high density capacitors, coils, resistors and trough wafer interconnect enable the realization of a highly miniaturized front-end module (FEM) for GSM without SMD's. Partitioning of passives is optimized to achieve minimum size (6times6times1 mm
³
) and low cost at acceptable performance.