3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities

A wireless interconnection scheme based on capacitive coupling provides mono- and bi-directional transmission capabilities for 3D system integration. Chips are implemented in 0.13mum CMOS and assembled face-to-face. RX-TX circuits are connected by 8times8mum
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electrodes and this enables the vertical propagation of clock at 17GHz, a propagation delay of 420ps for general purpose signals and a throughput of more than 22Mb/s/mum
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with 0.08pJ/b energy consumption