The Effects of Packaging on RFICs

Rapid growth of wireless market and competitive pressure has pushed the electrical performance of radio frequency integrated circuits (RFICs) to next level. The performance of RFICs at microwave frequencies depends very much on the package parasitic. Hence, the choice of proper packages depending on application of RFICs is of utmost importance. This paper describes our investigation of the effects of packaging (technology and material) on the performance of RFICs for different application areas