Evaluation of Linux Bonding Features

The paper contains an evaluation of the current Linux bonding implementation for wired interfaces. The Linux bonding provides methods to aggregate multiple wired interfaces to support load balancing, fault-tolerance and throughput improvement. The intention is to identify the performance of the current Linux bonding implementation and to use the results and assumptions for future discussions about bonding of wireless interfaces. The paper presents details about interface bonding in a RedHat Linux system and discusses measurement results of two bonded LAN interfaces using the round-robin bonding mode.