Millimeter-Wave Flip-Chip Front-End IC and Power Amplifier Using MBB Technology

This paper describes concepts and performance of millimeter-wave flip-chip IC and power amplifier using MBB (Micro Bump Bonding) technology. Two types of flip-chip technologies, MFIC (Millimeter-wave Flip-chip IC) and MBS (Micro Bump on Source electrode) technologies are introduced, and their applications to a K-band receiver front-end IC and a K-band power amplifier are presented.