Millimeter-wave Transceiver MCM Usig Multi-layer BCB with Integrated Planner Antenna

A novel millimeter-wave transceiver MCM using multi-layer BCB was proposed. This MCM is based on a glass substrate laminated with three layers of BCB thin film, enabling four-layer 3-D circuitry. We report two different Ka-band MCMs of this structure; namely, a flip-chip assembled 28 GHz transceiver MCM integrating four MMICs of independent functions, and a 38 GHz receiver MCM with built-in four-element slot antenna array and flip-chip assembled MMIC.