Increase stability D-Pak package transistors to thermal loadings

D-Pak package transistors of the raised heat dispersion capacity have a copper alloy crystal mount for maintenance of low thermal resistance. Various technologies of SMT soldering are connected to intensive heating, danger bursting transistor structure, penetration of moisture inside of the package and degradation transistor's characteristics. Influence constructive and technology factors on stability of transistors to thermal loadings up to 400deg C are investigated