Impact of untreated thicker CVD TiN film at a Via glue layer on Rc Performance in 0.15um CMOS Technology

In this work, it is reported that the mechanism was studied on abnormal via contact resistance (Rc) and the promising solutions to improve via Rc were proposed. We found out that via Rc is very sensitive to CVDTiN plasma treatment efficiency and also a slight fluctuation of CVDTiN thickness could significantly increase the amount of untreated CVDTiN film, leading to higher via Rc. This paper focuses on the impact of untreated thicker CVDTiN film at a via glue layer and the improvement solution of via Rc