Investigation of Hot Carrier Degradation Modes in LDMOS by using a Novel Three-Region Charge Pumping Technique

Hot carrier stress induced oxide degradation in n-LDMOS is investigated by using a novel three-region charge pumping technique. This technique allows us to locate oxide damage area in various stress modes and gain insight into trap creation properties. Our characterization shows that a max. I
_g
stress causes a largest drain current and subthreshold slope degradation because of both interface trap (N
_it
) generation in the channel region and negative bulk oxide charge (Q
_ox
) creation in the bird's beak region. The density of N
_it
and Q
_ox
can be separately extracted from the proposed charge pumping method. A numerical device simulation is performed to confirm our result