A 1024-pin plastic ball grid array for flip chip die

Described in this paper is a 1024-pin ball grid array package (BGA) that contains an area array die flip-chip mounted to a silicon transposer. The transposer, which fans the area array to two rows of pads on its periphery, is wire bonded to a printed circuit board substrate. Mechanical and electrical design considerations of the BGA are discussed, as well as the results of SPICE models.<
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