Reliability and thermal characterization of a 3-dimensional multichip module

Three dimensional packaging extends the high interconnection density which has been achieved using multichip modules to a new dimension. In this paper, we describe the fabrication of an unique 3-dimensional multichip module (3-D MCM) based on AT&Ts Si-on-Si Micro Interconnect technology. Four multichip tiles are interconnected on a multilayer metal-core printing wiring board. Eight such boards are then stacked vertically to form a 3-D module. Compliant anisotropically conductive elastomers are the key element in this design providing electrical interconnection between the stacked boards. The heat generated by the multichip tiles is conducted to the metal-core board and removed by air forced through holes on the perimeter of the boards. This paper describes results of a reliability evaluation of the vertical interconnect scheme. In addition a thermal characterization of the 3-D module is presented.<
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