A comparison of modelling methods for electronic interconnect structures

A comparison has been made between the use of 2-dimensional, axisymmetric and 3-dimensional geometry in the finite element analysis of a die attach assembly using conductive adhesives. The axisymmetric geometry was found to be a good approximation to the 3-dimensional geometry and gave considerable savings in computer resources and human effort. The true effect of the corners of the square die modelled was, however, not reflected in the stress level predicted by both of the more computationally efficient but simplified 2-dimensional and axisymmetric models.<
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