Modeling of Ti physical vapor deposition systems

A novel model for simulating Physical Vapor Deposition (PVD) systems is presented. The model determines profile evolution for deposition in trenches and vias by considering the major components in a PVD system. The simulator incorporates the effects of non-uniform target erosion, collimation, gas phase collisions, and particle sticking coefficients on profile evolution. Simulations for sputtered Ti are compared against experimental results.<
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