Chip on board (COB) multichip modules design possibilities and manufacturing

The author describes multichip module applications using COB for low-cost assembly of many dice on the same substrate even on both sides, to achieve full electronic circuitry miniaturization. Multichip modules on the FR4 PWB (printed wiring board) substrate are shown as an alternative to silicon on silicon, with in and out interconnection possibilities of particular note. This original packaging authorizes different shapes for modules. Surface mounted devices as well as leaded components are also added. Heat management is considered and explained through environmental test organization. Also, multichip silicon on silicon can be assembled on the same substrate to increase module performance and solve in and out connections from the main silicon dice.<
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