Multichip packaging technologies in IBM for desktop to mainframe computers

IBM currently manufactures six varieties of multichip module. They include air-cooled TCMs (thermal conduction modules) based on 63 layers of alumina-molybdenum with surface thin-film wiring, and water-cooled TCMs based on glass-ceramic/copper with thin-film redistribution. The four other multichips are all air-cooled and are based on ultradense thin film on silicon, high-density laminated printed wiring multichip with direct chip attach by flip-chip, and pinned, thin-film metallized multichip. The number of chips in these products ranges from 2 to 121, and the applications range from personal computers to mainframes.<
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