The realities of ASIC packaging

Summary form only given, as follows. ASIC is the technology driver for advanced packaging. This includes high-pin-count surface mount devices, high-performance ceramic packages, tape automated bonding (TAB) packages, and multichip modules (MCM). Emphasis is placed on fine-pitch technology (FPT) and the advantages and limitations of quad flat packs (QFP). Limitations due to power dissipation, ability to handle large die sizes, pin pitch below 0.4 mm, and coplanarity issues are addressed. Future trends in ASIC packaging are covered. A short introduction to multichip modules is also presented.<
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