Manufacturing cost analysis of optoelectronic integrated circuits

A modified version of a recently proposed cost model for millimeter and microwave integrated circuits is applied to the cost analysis of optoelectronic integrated circuits. The particular example that is examined is a four-function receiver module for optical interconnects. On the basis of this analysis, it is concluded that the lowest receiver module cost, for any level of production, is achieved by integrating the receiver at the rate of two functions per chip, rather than a full single-chip integration of the receiver. This observation is the result of the loss of functional yield and a reduction of the number of die per wafer incurred by the increased die size.<
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