Integration of SAW filter on PICS substrate using polymer sealing

This paper presents a technique to integrate a die containing an electro-mechanical component on a passive integration connecting substrate (PICS) using a polymer-sealing ring. The active die is also used as a capping substrate and the polymer ring acts as a bonding and sealing material. Two polymers are tested, the Benzocyclobutene (BCB) and the SU-8. The fabrication process is described and packages are characterized in terms of mechanical strength. A finite element model was used to simulate the behavior of the heterogeneous flip-chip package when submitted to thermal and mechanical loads