Physical Design Automation Challenges for 3D ICs

Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm will require a major change in design methodologies, and an optimal 3D design will look very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of 3D-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits.