I/O options for MCNC multichip package

A strategy for signal and power connections to the MCNC multichip module is formulated. The module structure is described in detail. System trends and scaling theory are used to define requirements for three generations of multichip module technology extending to the year 2000. The state of the art of computer manufacturers and development activities of connector vendors is discussed. Pin, pinless, and flexible circuit technologies are described, with specific combinations of technologies being fitted to the MCNC substrate. The intent is to generate a menu of compatible technologies and applications.<
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