Lifetime Estimation for Wire Bond Interconnections using Life-Cycle-Information Modules with Implemented Models

Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Furthermore such information could improve future product design, market research and quality management. This paper describes a modular concept for life-cycle monitoring, as well as the identification of use conditions, reliability assessment and diagnosis of insulated gate bipolar transistors (IGBT) with a focus on the wire bond interconnections