EMI simulation and measurements of multilayer structures for microprocessor packaging applications

This paper presents an approach to understand the possible EMI sources in a complex microprocessor package. Simulation and measurements have been employed to characterize and understand the EMI emission from a test vehicle that resembles a microprocessor packages. The vehicle contained structures that are regularly find in processor packages. Detailed models of the test vehicle have been simulated using a commercial numerical simulation tool to understand and quantify the filed emission and the results have been compared with the measurements done in anechoic chamber. Good correlations were achieved between the measurements and simulations up to 5GHz. Advantages and limits of the simulation and measurements are presented and addressed.