Effect of Die Bonding on MEMS Characteristics: Cell Library Study

Thermal mismatch induced by the die bonding structure will have a great effect on the reliability and performance of MEMS devices. A Cell Library Method is introduced here as an alternative against conventional FEM simulation to simplify the package-device co-design and the parametric study of MEMS components. Cells of package substrate, anchor and micro-beam are first modeled individually and then integrated together on their boundary conditions to study the concerned response. Effects of die bonding on the pull-in voltage of a doubly supported micro-beams are predicted using this method and the results are in good agreement with FEM calculations. This study indicates the importance of package-device co-design and the need for the development of MEMS own standard package solutions aiming at stress miniaturization and modeling simplification.