Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments

This study characterizes a low expansion PCB composed of STABLCOR ®/FR4 laminate that is suitable for flip-chip applications exposed to extreme operating environments from –55°C to +150°C. We demonstrate that the STABLCOR ®/FR4 laminate exhibits approximately 80% reduction in CTE and greater stiffness characteristics as compared to typical FR4 material. Additionally, we demonstrate that the laminate successfully passes flammability, thermal vacuum stability, and toxicity testing as required for pressurized and un-pressurized Space applications. Fabricated